Description
ESP32-D0WD-V3 dual-core Wi-Fi and Bluetooth MCU, compiled from manufacturer datasheets and distributor listings.
Technical Specifications
Product Features
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Proven Dual-Core Performance: Powered by the Xtensa® 32-bit LX6 dual-core microprocessor, offering robust processing capability at up to 240 MHz for a wide range of IoT and embedded applications .
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Integrated Wireless Connectivity: Combines 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 4.2 in a single chip, supporting a data rate of up to 150 Mbps . The RF output power reaches 20.5 dBm with a receive sensitivity of -97 dBm .
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Sufficient On-Chip Memory: Features 448 KB ROM and 520 KB SRAM for program execution and data processing .
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Rich Peripheral Set: Offers 34 programmable GPIOs supporting a comprehensive range of digital interfaces including ADC, I2C, I2S, SDIO, SPI, PWM, and UART for flexible system design .
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Wide Operating Temperature Range: Rated for -40°C to +125°C, suitable for demanding industrial and outdoor applications .
Design Notes
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Package Variants: The ESP32-D0WD-V3 is a QFN-48 package variant . This distinguishes it from the ESP32-S3R8 (QFN-56) you inquired about earlier. The ESP32-D0WD-V3 is the updated version of the original ESP32-D0WD chip .
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Power Consumption: During Wi-Fi operation, the chip draws 95mA to 100mA when receiving and 130mA to 240mA when transmitting
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