ESP32-S3R8 Wi-Fi + BLE5 32-bit dual-core MCU QFN-56 Chip

Description

 ESP32-S3R8 Wi-Fi + BLE 5.0 32-bit Dual-Core MCU, based on the official datasheet from Espressif Systems.

Technical Specifications

Product Features

• High-Performance Dual-Core Processor: Powered by a Xtensa® 32-bit LX7 dual-core microprocessor running at up to 240 MHz, delivering strong AI acceleration capabilities with vector instructions .

• Advanced Wireless Connectivity: Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 (LE) with support for Bluetooth Mesh, high power mode (20 dBm), and an internal coexistence mechanism for sharing a single antenna .

• Ample On-Chip Memory: Integrated 384 KB ROM and 512 KB SRAM, with an additional 8 MB Octal SPI PSRAM stacked inside the package for expanded memory capacity .

• Rich Peripheral Interfaces: Features 45 programmable GPIOs supporting a comprehensive set of digital interfaces including SPI, I2C, I2S, UART, USB OTG, SD/MMC, LCD, and camera interface, making it ideal for complex IoT and multimedia applications .

• Comprehensive Security Features: Includes hardware-accelerated encryption (AES, SHA, RSA), secure boot, flash encryption, and a digital signature peripheral to ensure robust security for connected devices .

Design Notes

• Marking and Variants: The “R8” in the part number indicates the chip is packaged with 8 MB of stacked PSRAM . The ESP32-S3R8V variant exists as an alternative, but it is important to note that recent official documentation marks the “R8V” as End-of-Life (EOL) and directs designs toward the “R8” variant .

• Moisture Sensitivity Level (MSL): The ESP32-S3R8 carries a MSL rating of 3, indicating a floor life of 168 hours once the moisture barrier bag is opened. Proper handling and baking procedures are required before reflow soldering .

• GPIO Availability: Please note that the number of available GPIOs is 30, although the chip itself supports 45. The package QFN-56 has 30 GPIOs exposed