Type: N-channel enhancement-mode power MOSFET (HEXFET / TrenchFET).
Drain-Source Voltage (V<sub>DS</sub>): 100 V maximum.
Gate-Source Voltage (V<sub>GS</sub>): ±16 V (max) per datasheet absolute max.
Continuous Drain Current (I<sub>D</sub>): up to 17 A (at 25 °C, in D-PAK package)
Drain-Source On-Resistance (R<sub>DS(on)</sub>):
≤ 0.105 Ω typical (at V<sub>GS</sub> = 10 V)
≤ 0.155 Ω max (at V<sub>GS</sub> = 4.5 V)
Total Power Dissipation (P<sub>D</sub>): ~79 W (when properly heat-sunk, per datasheet)
Gate Charge (Q<sub>G</sub>): ~22.7 nC (at V<sub>GS</sub> ~4.5–10 V)
Mounting / Package: D-PAK (surface-mount, TO-252 / TO-252-3 / DPAK package)
Operating Junction Temperature: –55 °C to +175 °C (T<sub>j</sub> max)
Special Features: Fully avalanche-rated, rugged HEXFET structure, suitable for switching applications, general-purpose MOSFET usage.
IRLR3410 is well-suited for:
DC/DC converters, switching regulators, power supplies.
Load switching, power switching, MOSFET-based relays or power management.
Motor drivers (DC motors, brushless control), solenoids, inductive or resistive loads.
General-purpose high-voltage (up to 100 V) switching in compact SMT designs.
Applications requiring moderate current (few to ~15 A) with reliable switching and reasonable on-resistance.
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