Multi-package patch type experimental board
Material: fiberglass, single side, blue Color
Specifications: 9*11cm
Thickness: 1.6mm
Spacing: 2.54
Aperture: 1.0MM
Mainly used in the circuit construction process of SMD LQFP and SOP packaged devices. Compatible with TQFP64, TQFP32, TQFP48, MSOP8, WSOP28, SOT23-5, QSOP28, SSOP chips. It can be compatible with chips with up to SOP28 pins. The standard spacing between pins is 2.54MM. All pins are led out to the debug board socket. It greatly facilitates the construction and debugging of chip circuits for chip packaging.
QSOP, used for chips with a pin pitch of 0.65mm,
TQFP48.TQFP64 pin pitch is 0.5mm
TQFP32, pin pitch is 0.8mm
| Weight | 0.009 kg |
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