ESP32S WIFI BLE SMD MODULE

Description

ESP-32S Wifi Bluetooth combo module base on ESP32 which is a single-chip 2.4 GHz Wi-Fi and Bluetooth combo chip designed with TSMC ultra-low-power 40 nm technology. It is designed and optimized for the best power performance, RF performance, robustness, versatility, features, and reliability, for a wide variety of applications, and different power profiles.

ESP-32S integrates the dual-core processor, 448 KByte ROM,520 KByte SRAM,16 KByte SRAM in RTC, 802.11 b/g/n/e/I Wi-Fi, Bluetooth v4.2 BR/EDR & BLE, clocks & Times, abundant peripheral Interfaces, and security mechanism.

ESP32 is the most integrated solution for Wi-Fi + Bluetooth applications in the industry with less than 10 external components. ESP32 integrates the antenna switch, RF balun, power amplifier, low noise receive amplifier, filters, and power management modules. As such, the entire solution occupies a minimal Printed Circuit Board (PCB) area.

ESP32 is designed for mobile, wearable electronics, and the Internet of Things (IoT) applications. It has many features of the state-of-the-art low power chips, including fine resolution clock gating, power modes, and dynamic power scaling.

Specs

• CPU and Memory
  • Xtensa® Dual-Core 32-bit LX6 microprocessors, up to 600 DMIPS
  • 448 KByte ROM
  • 520 KByte SRAM
  • 16 KByte SRAM in RTC
  • QSPI Flash/SRAM, up to 4 x 16 MBytes
  • Power supply: 2.2 V to 3.6 V
• Clocks and Timers
  • Internal 8 MHz oscillator with calibration
  • Internal RC oscillator with calibration
  • External 2 MHz to 40 MHz crystal oscillator
  • External 32 kHz crystal oscillator for RTC with calibration
  • Two timer groups, including 2 x 64-bit timers and 1 x main watchdog in each group
  • RTC timer with sub-second accuracy
  • RTC watchdog
• Advanced Peripheral Interfaces
  • 12-bit SAR ADC up to 18 channels
  • 2 × 8-bit D/A converters
  • 10 × touch sensors
  • Temperature sensor
  • 4 × SPI
  • 2 × I2S
  • 2 × I2C
  • 3 × UART
  • 1 host (SD/eMMC/SDIO)
  • 1 slave (SDIO/SPI)
  • Ethernet MAC interface with dedicated DMA and IEEE 1588 support
  • CAN 2.0
  • IR (TX/RX)
  • Motor PWM
  • LED PWM up to 16 channels
  • Hall sensor
  • Ultra low power analog pre-amplifier
  • PCB antenna/external IPEX
• Operating Temperature Range: -40 ° C to + 85 ° C
• Package size: 18mm x 25mm x 2.8mm